%0 Journal Article
%T New de-embedding structures for extracting the electrical parameters of a through-silicon-via pair<br>
%A Zhou Jing
%A Wan Lixi
%A Li Jun
%A Wang Huijuan
%A Dai Fengwei
%A Daniel Guidotti
%A Cao Liqiang
%A <br>
%J 半导体学报
%D 2013
%I 
%K through-silicon vias
%K de-embedding structure
%K microwave network
%K multiple solutions
%K transmission matrix
%K equivalent circuit<br>
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=1319827C0C74AAE8D654BEA21B7F54D3&jid=025C8057C4D37C4BA0041DC7DE7C758F&aid=DFEDDF274BE1BF809FC5BFB28E8F3273&yid=FF7AA908D58E97FA&vid=339D79302DF62549&iid=E158A972A605785F&sid=B2B25644A2AE9B90&eid=DF92D298D3FF1E6E&journal_id=1674-4926&journal_name=半导体学报&referenced_num=0&reference_num=13