%0 Journal Article
%T Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate<br>
%A Qiulian Zeng
%A Jianjun Guo
%A Xiaolong Gu
%A Xinbing Zhao
%A Xiaogang Liu
%A <br>
%J 材料科学技术学报
%D 2010
%I 
%X Sn-10Sb-5Cu lead-free solder was fabricated for high temperature application in electronic package. Wetting behaviors and interfacial reaction between such a high temperature lead-free solder and Cu substrate were investigated and compared with those of 95Pb-Sn solder. The results showed that the wetting properties of Sn-10Sb-5Cu solder are superior to those of 95Pb-Sn solder in maximum wetting force, wetting time and wetting angle in the temperature range of 340{400°C. However, the surface of the Sn-10Sb-5Cu solder sample after wetting balance tests was rougher than that of 95Pb-Sn solder at the temperature lower than 360°C. In static liquid-state interfacial reaction, the types and thickness of the intermetallic compounds (IMCs) of both solders were different from each other. The wetting kinetics in the Sn-10Sb-5Cu/Cu system was more rapid than that in 95Pb-Sn /Cu system, and the higher formation rate of IMCs in the former system was considered as the reason.
%K Wetting
%K Interfacial reaction
%K High temperature lead-free solder
%K Sn-10Sb-5Cu solder<br>
%U http://www.alljournals.cn/get_abstract_url.aspx?pcid=5B3AB970F71A803DEACDC0559115BFCF0A068CD97DD29835&cid=84529CA2B2E519AC&jid=324DC3CAB22330DB19158AE0A9B7BFA5&aid=710122B55DC4C8236BD0D860D997E0CC&yid=140ECF96957D60B2&vid=96C778EE049EE47D&iid=0B39A22176CE99FB&sid=3F0AF5EDBC960DB0&eid=F1177A9DF1349B63&journal_id=1005-0302&journal_name=材料科学技术学报&referenced_num=0&reference_num=27