%0 Journal Article
%T An Overall Ltcc Package Solution for X-Band Tile T/R Module
%A Zhong Jun Yu
%A Zheng Xu
%A Yun-Kai Deng
%A Zhi-Guang Zhang
%J PIER     Letters
%D 2013
%I EMW Publishing
%R 10.2528/PIERL13011009
%X An overall Low-Temperature Co-fired Ceramics (LTCC) package solution for X-band T/R module has been presented in this paper. This tile type package contributes to a dramatic reduction in size and weight of the T/R module. Moreover, an obvious merit of ceramic housing is better consistency of Coefficient of Thermal Expansion (CTE), compared with the traditional combination of ceramic board and metal housing. The schematic diagram and 3-D structure of the T/R module have been presented and a novel vertical interconnection based on Ball Grid Array (BGA) has been proposed to connect vias in the lid and those in the stage of the main LTCC pan. The LTCC T/R module has been fabricated and measured. It is compact in size (20¡Á20¡Á 2.6 mm) and has a weight of 3.5 g. The measured transmit output power is 33¡À1 dBm in the frequency range from 8.8 GHz to 10.4 GHz, and the measured receive gain and Noise Figure are 29-30.5 dB and 2.6-2.8 dB, respectively.
%U http://www.jpier.org/pierl/pier.php?paper=13011009