%0 Journal Article
%T Highly Productive Process Technologies of Cantilever type Microprobe Arrays for Wafer Level Chip Testing
%A Woo-Chang Choi
%A Jae-Hwan Lim
%A Jee-Youl Ryu
%J Transactions on Electrical and Electronic Materials
%D 2013
%I Korean Institute of Electrical and Electronic Material Engineers (KIEEME)
%R http://dx.doi.org/10.4313/teem.2013.14.2.63
%X This paper describes the highly productive process technologies of microprobe arrays, which were used for a probecard to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobearrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bondingmaterial, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer.The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by aconventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignmentand planarity errors within ¡À5 ¦Ìm and ¡À10 ¦Ìm, respectively. In addition, the average leakage current and contactresistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes canbe applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.
%K Microprobes
%K Cantilever-type
%K MEMS
%K Highly productive process
%K Au-Sn bonding
%U http://dx.doi.org/10.4313/TEEM.2013.14.2.63