%0 Journal Article
%T Coupling between Vias and the PCB Power-Bus
%A G. Heinrich
%A S. Dickmann
%J Advances in Radio Science : Kleinheubacher Berichte
%D 2009
%I Copernicus Publications
%X In this paper, a method for the extraction of data for a through-hole vertical interconnect access (via) on a printed circuit board (PCB) is presented. It uses a matrix de-embedding algorithm and two-port theory to extract the elements of an assumed lumped via model. After that the influence of the via on the power-bus impedance and the coupling between the via and the power-bus are described using this model.
%U http://www.adv-radio-sci.net/7/261/2009/ars-7-261-2009.pdf