%0 Journal Article
%T EXPERIMENTAL EVALUATIONS AND PERFORMANCE OF THE ALUMINUM -SILICON CARBIDE PARTICLES (SICP) METAL MATRIX COMPOSITE
%A KARAN SINGH
%A Dr. MOHAMMAD ISRAR
%J International Journal of Mechanical Engineering & Technology (IJMET)
%P 68-86
%@ 0976 - 6359
%D 2016
%X Stresses induced due to thermal mismatch between the metal matrix and the ceramic reinforcement in metal matrix composite may impart plastic deformation to the matrix there by resulting in a reduction of the residual stresses. Thermal mismatch strains also may quite often crack the matrix resulting in a relaxation of the residual stresses. The interface in MMCs is a porous, noncrystalline portion in comparison with the matrix or the reinforcement (metal matrix and ceramic reinforcement in this case). Therefore residual stresses are readily released at the porous and noncrystalline interface as a result of which when particle density is high, i.e. in regions which are particle starved, meaning the availability of the interface is limited, particle fracturing is predominating. In the present investigation ring-shaped Al-SiCp MMCs are fabricated in the solid state processing route. The sintering temperature and time of holding at the sintering temperature are varied and the samples are subjected to thermal shock at +800C and at -800C in different batches. The radial crushing strength of the specimens are determined using Instron-1195 adopting standard test methods. Extensive micrographs of the fractured surfaces are analyzed. Assessment and evaluation on the basis of mechanical properties reveal that thermal shock due to a sub-ambient temperature is more damaging compared to that due to an exposure to an elevated temperature. The micrographs studies reveal that in general when the thermal shock is due to the exposure to an elevated temperature, the dominating failure mode is cavity generation at the interface, i.e. nucleation and coalescence of voids foe the formation and propagation of cracks at interface region leading to final failure. The micrographs further reveal that in the case of a thermal shock caused due to exposure to a sub-ambient temperature, the dominating failure mode is due to interfacial failure/or matrix damage.
%K Metal matrix Composites
%K Aluminium¨CSilicon Carbide
%U http://www.iaeme.com/MasterAdmin/UploadFolder/EXPERIMENTAL%20EVALUATIONS%20AND%20PERFORMANCE%20OF%20THE%20ALUMINUM%20%20SILICON%20CARBIDE%20PARTICLES%20%20SICP%20METAL%20MAs/EXPERIMENTAL%20EVALUATIONS%20AND%20PERFORMANCE%20OF%20THE%20ALUMINUM%20%20SILICON%20CARBIDE%20PARTICLES%20%20SICP%20METAL%20MAs.pdf