%0 Journal Article
%T Analysis on Micro Complex Shape Via Hole Punching on Low Temperature Co-Fired Ceramics
%A Vahdat Astani Che
%A Junfeng Yang
%A Zuyuan Yu
%J New Journal of Glass and Ceramics
%P 1-13
%@ 2161-7562
%D 2020
%I Scientific Research Publishing
%R 10.4236/njgc.2020.101001
%X The quality of a via hole on a multilayer stack of Low Temperature Co-fired Ceramic (LTCC) tape is of utmost importance to its functionality. This paper investigates a substitute for the commonly used circular shape hole to a more complex one and its implications when different parameters such as sheet thickness, punch speed, travel distance and tool clearance </span><span style=\"font-family:Verdana;\">are</span><span style=\"font-family:Verdana;\">&nbsp;changed. Fabrication of the punch tools and the punching process is carried out at the same machine, ensuring alignment. Two types of non-circular shape are chosen to carry out the experiment. Pre-sintered complex shape hole measurements show that while punch conditions such as speed and tool gap ha</span><span style=\"font-family:Verdana;\">ve</span><span style=\"font-family:Verdana;\">&nbsp;little effect on the size, sheet thickness and travel depth play a vital role in the overall dimension. Albeit having only a slight effect on the size, those parameters are significant </span><span style=\"font-family:Verdana;\">i</span><span style=\"font-family:Verdana;\">n other aspects of hole quality. Post-sintering investigation is also observed and discussed.<
%K Low Temperature Co-Fired Ceramic Packaging
%K Non-Circular Via Holes
%K Micro-Hole Punching
%U http://www.scirp.org/journal/PaperInformation.aspx?PaperID=98211