%0 Journal Article
%T Package Design Optimization with Reliability Test Verification for Reduction of Voids and Delamination
%A Frederick Ray I. Gomez
%A Rammil A. Seguido
%J Asian Journal of Engineering and Technology
%D 2018
%R 10.24203/ajet.v6i6.5604
%X Package down-scaling or miniaturization has become the trend in semiconductor industry, with smaller and thinner package being the prime objective.£¿ Stacked dice process in semiconductor packages is now also becoming popular as semiconductor industries try to come up with products that offer multiple channels in a small IC (integrated circuit) package.£¿ However, as different dice are brought together, several challenges have to be overcome in terms of package design and assembly.This technical paper specifically considers the challenges encountered in the development of a compact and thinner package that incorporates multiple or stacked dice in one.£¿ For the case of this paper, Die1 is smaller than Die2 and must be the first one to be die bonded, making the internal construction an unbalanced stacked dice.£¿ Normally, stacked dice is in pyramid layout, wherein a single large die supports smaller top die.£¿ Nevertheless, success is measured when there is a solution to control die attach voids and eliminate or significantly minimize delamination for unbalanced stacked dice as mentioned.£¿ Ultimately, the paper presents the understanding of the factors involved and the package design optimization approach used to produce a successful unbalanced stacked die in a thin package using thin substrate
%K [Semiconductor package
%K planarized
%K stacked dice]
%U https://www.ajouronline.com/index.php/AJET/article/view/5604