%0 Journal Article
%T 聚酰亚胺改性C/C复合材料的制备及性能<br>Preparation and properties of polyimide modified C/C composites
%A 耿真真
%A 李红
%A 杨敏
%A 任慕苏
%A 孙晋良
%J 复合材料学报
%D 2019
%R 10.13801/j.cnki.fhclxb.20180428.004
%X 采用针刺成型、化学气相渗透（CVI）、真空浸渍及固化成型工艺制备了C/C-聚酰亚胺（C/C-PI）复合材料，研究了这种新型防热结构材料的弯曲性能、导热性能及热膨胀性能。结果表明：C/C-PI复合材料XY向和Z向弯曲强度分别为120.75 MPa和40.33 MPa，较C/C复合材料分别提高了17.92%和20.57%，表现出更优异的弯曲性能；C/C-PI复合材料热导率随温度变化不显著，XY向和Z向热导率均在150℃达到最大值，分别为29.88 W（m·℃）-1和9.93 W（m·℃）-1，较C/C复合材料分别降低了47.02%和56.12%；随温度升高，C/C-PI复合材料的线膨胀系数呈线性缓慢增长，数值保持低于4×10-6 K-1，尤其XY向较Z向具有更低的线膨胀系数，可满足热结构件尺寸稳定性的使用需求。 Polyimide modified C/C (C/C-PI) composites were fabricated by needling technology, chemical vapor infiltration (CVI), vacuum impregnation and curing process. The flexural properties, heat conducting properties and thermal expansion properties of C/C-PI composites were investigated. The results indicate that C/C-PI composites show a better flexural strength of 120.75 MPa in XY direction and 40.33 MPa in Z direction which are 17.92% and 20.57% higher than C/C composite. The thermal conductivities of C/C-PI composites do not change significantly with temperature, and reach the maximum values of 29.88 W(m·℃)-1 in XY direction and 9.93 W(m·℃)-1 in Z direction, which are 47.02% and 56.12% lower than C/C composites, respectively. As the test temperature continues to rise, the thermal conductivities of C/C-PI and C/C composites are decreasing gradually. The coefficients of linear expansion of C/C-PI composites increase linearly with the increase of temperature and the values maintain under 4×10-6 K-1. In particularly, C/C-PI composites have a lower linear expansion coefficient in XY direction in comparison with Z direction, which can meet the requirement of dimension stability of thermal structure parts. 国家重点研发计划（2016YFE0111200
%K 聚酰亚胺
%K C/C
%K 弯曲强度
%K 热导率
%K 线膨胀系数<br>polyimide
%K C/C
%K flexural strength
%K thermal conductivity
%K linear expansion coefficient
%U http://fhclxb.buaa.edu.cn/CN/abstract/abstract14339.shtml