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CYCLIC PLASTIC BEHAVIOUR OF UFG COPPER UNDER CONTROLLED STRESS AND STRAIN LOADINGKeywords: UFG Cu , ECAP , Fatigue , Stress- and strain-controlled loading Abstract: The influence of stress- and strain-controlled loading on microstructure and cyclic plastic behaviour of ultrafine-grained copper prepared by equal channel angular pressing was examined. The stability of microstructure is a characteristic feature for stress-controlled test whereas grain coarsening and development of bimodal structure was observed after plastic strain-controlled tests. An attempt to explain the observed behaviour was made.
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