Turbulent mixed flow applying CFD in electronic cooling

The commercial application CFX v. 10.0 was used to assess the thermal parameters of electronic devices in which several speed values were explored in a model with a turbulent mixed forced cooling flow. The finite-volume method was used to solve the problem equations throughout the physical domain with the standard k- turbulence model. It was observed that the maximum temperature is not affected by influence of heat flux in the laminar and turbulent fluxes until heat flux equal 1,000 and maximum dimensionless temperature increase abruptly with heat flux to laminar and turbulent flows for injection dimensionless velocity equal 1, 2, 4, 6, 8, and 10. The results obtained allowed identifying the highest temperature when the system is submitted to combine forced and free convection, making possible to apply control actions, avoiding thermal damages to the devices that work with this cooling process.