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Adsorption of Copper from an Ammonia-Thiosulfate Media Using DOWEX 550A Ion Exchange Resin

DOI: 10.4236/ijnm.2016.54005, PP. 33-44

Keywords: Adsorption, Desorption, Copper, Ion Exchange Resin, Ammonia-Thiosulfate

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Abstract:

The study of copper adsorption onto ion exchange resins of anionic type is part of the gold recovery from ammonia-thiosulfate solutions, where copper is the main impurity of the system because it acts as a catalyst of gold dissolution reaction. A study is made of the adsorption and desorption of copper in the form of the ?\"\"complex in an ammonia-thiosulfate media on an ion exchange resin, DOWEX 550A, classified as a strong base, which in its inner structure has a quaternary amine functional group. In the studied pH range copper adsorption increased with increasing pH, while the presence of thiosulfate decreased it, the same as the ammonia content, due to the greater presence of cuprotetramine, \"\". Elution of the copper complexes from the resin was more efficient with sulfite than with perchlorate.

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