Microspheres of Al have been successfully fabricated utilizing electromigration using sudden change in geometrical shape of a specimen. The experimental sample was a passivated Al line with a hole at the transitional area of the sample. The hole was used to control the accumulation and discharge process. The formation of the microsphere is enhanced by controlling temperature and current density. The atomic flux was increased with the increasing current density that was happened along the electron flow direction in the small region at the geometrical shape of the sample.
References
[1]
Tian, M., Wang, J., Snyder, J., Kurtz, J., Liu, Y., Schiffer, P., Mallouk, T.E. and Chan, M.H.W. (2003) Synthesis and Characterization of Superconducting Single-Crystal Sn Nanowires. Applied Physics Letter, 83, 1620-1622.
https://doi.org/10.1063/1.1601692
[2]
Motoyama, M., Fukunaka, Y., Sakka, T., Ogata, Y.H. and Kikuchi, S. (2005) Electrochemical Processing of Cu and Ni Nanowire Arrays. Journal of Electroanalytical Chemistry, 584, 84-91. https://doi.org/10.1016/j.jelechem.2005.07.023
[3]
Brenner, S.S. (1956) The Growth of Whiskers by the Reduction of Metal Salts. Acta Metallurgica, 4, 62-74. https://doi.org/10.1016/0001-6160(56)90111-0
[4]
Zhang, J., Qing, X., Jiang, F. and Dai, Z. (2003) A Route to Ag-Catalyzed Growth of the Semiconducting In2O3 Nanowires. Chemical Physics Letters, 371, 311-316.
https://doi.org/10.1016/S0009-2614(03)00272-0
[5]
Black, J.R. (1969) Electromigration—A Brief Survey and Some Recent Results. IEEE Transactions on Electronic Devices, 16, 338-347.
https://doi.org/10.1109/T-ED.1969.16754
[6]
Blech, I.A. and Herring, C. (1976) Stress Generation by Electromigration. Applied Physics Letters, 29, 131-133. https://doi.org/10.1063/1.89024
[7]
Korhonen, M.A., Borgesen, P., Tu, K.N. and Li, C.Y. (1993) Stress Evolution Due to Electromigration in Confined Metal Lines. Journal of Applied Physics, 73, 3790-3799. https://doi.org/10.1063/1.354073
[8]
Saka, M., Yamaya, M. and Tohmyoh, H. (2007) Rapid and Mass Growth of Stress-Induced Nanowhiskers on the Surfaces of Evaporated Polycrystalline Cu Films. Scripta Materialia, 56, 1031-1034. https://doi.org/10.1016/j.scriptamat.2007.02.036
[9]
Saka, M. and Nakanishi, R. (2006) Formation of Al Thin Wire by Utilizing Controlled Accumulation of Atoms Due to Electromigration. Materials Letters, 60, 2129-2131. https://doi.org/10.1016/j.matlet.2005.12.107
[10]
Lu, Y. and Saka, M. (2009) Fabrication of Al Micro-Belts by Utilizing Electromigration. Materials Letters, 63, 2227-2229. https://doi.org/10.1016/j.matlet.2009.07.031
[11]
Lu, Y., Tohmyoh, H. and Saka, M. (2011) Forming Microstructures by Controlling the Accumulation and Discharge of Al Atoms by Electromigration. Journal of Physics D: Applied Physics, 44, Article ID: 045501.
https://doi.org/10.1088/0022-3727/44/4/045501
[12]
Sun, Y., Tohmyoh, H. and Saka, M. (2009) Fabrication of Al Microspheres by Utilizing Electromigration. Journal of Nanoscience and Nanotechnology, 9, 1972-1975.
https://doi.org/10.1166/jnn.2009.444
[13]
Kamal, F.M. and Saka, M. (2011) An Approach Using Sudden Change in Geometrical Shape of a Sample for Fabricating Micro/Nano Metallic Materials Utilizing Elctromigration. Proceedings of 13th International Conference on Electronic Materials and Packaging (EMAP 2011), Kyoto, 12-15 December 2011.
[14]
Huntington, H.B. and Grone, A.R. (1961) Current Induced Marker Motion in Gold Wires. Journal of Physics and Chemistry of Solids, 20, 76-87.
https://doi.org/10.1016/0022-3697(61)90138-X
[15]
Blech, A. (1976) Electromigration in Thin Aluminum Films on Titanium Nitride. Journal of Applied Physics, 47, 1203-1208. https://doi.org/10.1063/1.322842
