Improvement of graphene oxide/epoxy resin adhesive properties through interface modification

The heat-conducting, dielectric, and bonding properties of a composite adhesive have been enhanced using toluene diisocyanate (TDI) to chemically modify the interface between graphene oxide (GO) and epoxy resin (EP), which was characterized using Fourier-transform infrared spectroscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy. The thermal conductivity of TDI10-GO0.5/EP was 0.624 W·m？1·K？1 (166% of EP and 117% of GO0.5/EP), with its TDI10-GO0.5/EP interfacial thermal resistance being reduced by a factor of 36 times GO0.5/EP. The insulating properties of the adhesive in small resistors and capacitors were improved by the inclusion of GO, with the dielectric strength of the adhesive shown to be 25.96 kV·mm？1 and its volume resistivity found to be 1.50 × 1014 Ω·m