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中空玻璃微珠对超高性能混凝土的阻抗提升研究
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Abstract:
在地铁轨道等地下结构中，为预防跨步电压造成的安全隐患问题，采用中空玻璃微珠制备了高阻抗UHPC。结果表明：中空玻璃微珠能够形成新的基体–玻璃外壳界面，降低基体的电导率。掺入15%的中空玻璃微珠后，UHPC的电阻率达到了14.39 kΩ？m，较对照组提高了101.72%。
In order to prevent the safety hazard problem caused by step voltage in subway structures such as subway tracks, high-impedance UHPC was prepared by using hollow glass microspheres. The results show that hollow glass microspheres can form a new substrate-glass shell interface and reduce the conductivity of the substrate. The resistivity of UHPC reached 14.39 kΩ？m after 15% of hollow glass microspheres were doped, which was 101.72% higher than that of the control.
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