Although there are many lead-free soldering alloys on the market, none of them have ideal qualities. The researchers are combining binary alloys with a variety of additional materials to create the soldering alloys’ features. The eutectic Sn-9Zn alloy is among them. This paper investigated the mechanical and electrical properties of Sn-9Zn-x (Ag, Cu, Sb); {x = 0.2, 0.4, and 0.6} lead-free solder alloys. The mechanical properties such as elastic modulus, ultimate tensile strength (UTS), yield strength (YS), and ductility were examined at the strain rates in a range from 4.17 10？3 s？1 to 208.5 10？3 s？1 at room temperature. It is found that increasing the content of the alloying elements and strain rate increases the elastic modulus, ultimate tensile strength, and yield strength while the ductility decreases. The electrical conductivity of the alloys is found to be a little smaller than that of the Sn-9Zn eutectic alloy.
References
[1]
Binh, D.N. (2005) Investigations on the Properties of Sn-8Zn-3Bi Lead-Free and Sn-37Pb Eutectic Solder Alloys. Master’s Thesis. http://eprints.usm.my/6555/1/INVESTIGATIONS_ON_THE_PROPERTIES_OF_Sn-8Zn-3Bi_LEAD-FREE.pdf
[2]
Mishra, P. (2014) Determination and Characterisation of Lead Free Solder Alloys. Master’s Thesis, National Institute of Technology Rourkela.
[3]
Collins, M.N., Punch, J., Coyle, R., Reid, M., Popowich, R., Read, P., et al. (2011) Thermal Fatigue and Failure Analysis of SnAgCu Solder Alloys with Minor Pb Additions. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1, 1594-1600. https://doi.org/10.1109/TCPMT.2011.2150223
[4]
Ramli, M.I.I., Saud, N., Salleh, M.A.A.M., Derman, M.N. and Said, R.M. (2016) Effect of TiO2 Additions on Sn-0.7Cu-0.05Ni Lead-Free Composite Solder. Microelectronics Reliability, 65, 255-264. https://doi.org/10.1016/j.microrel.2016.08.011
[5]
Islam, R.A., Chan, Y.C., Jillek, W. and Islam, S. (2006) Comparative Study of Wetting Behavior and Mechanical Properties (Microhardness) of Sn-Zn and Sn-Pb Solders. Microelectronics Journal, 37, 705-713. https://doi.org/10.1016/j.mejo.2005.12.010
[6]
Chen, W.X., Xue, S.B., Wang, H. and Hu, Y.H. (2010) Reliability Studies of Sn–9Zn/Cu and Sn–9Zn–0.3 Ag/Cu Soldered Joints with Aging Treatment. Journal of Materials Science: Materials in Electronics, 21, 779-786. https://doi.org/10.1007/s10854-009-9993-1
[7]
Cheng, S., Huang, C.M. and Pecht, M. (2017) A Review of Lead-Free Solders for Electronics Applications. Microelectronics Reliability, 75, 77-95. https://doi.org/10.1016/j.microrel.2017.06.016
[8]
Union European (2003) 95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment. Official Journal of the European Union, 37, 19-23.
[9]
Collins, M. N., Punch, J. and Coyle, R. (2012) Surface Finish Effect on Reliability of SAC 305 Soldered Chip Resistors. Soldering & Surface Mount Technology, 24, 240-248. https://doi.org/10.1108/09540911211262520
[10]
Liu, L.J., Wu, P. and Zhou, W. (2014) Effects of Cu on the Interfacial Reactions Between Sn-8Zn-3Bi-xCu Solders and Cu Substrate. Microelectronics Reliability, 54, 259-264. http://Dx.Doi.Org/10.1016/J.Microrel.2013.10.001
[11]
EL-Daly, A.A. and Hammond, A.E. (2011) Development of High Strength Sn-0.7Cu Solders with the Addition of Small Amount of Ag and In. Journal of Alloys and Compounds, 509, 8554-8560. https://doi.org/10.1016/j.jallcom.2011.05.119
[12]
Hayes, S.M., Chawla, N. and Frear, D.R. (2009) Interfacial Fracture Toughness of Pb-Free Solders. Microelectronics Reliability, 49, 269-287. https://doi.org/10.1016/j.microrel.2008.11.004
[13]
(2016) Directive 2002/95/EC of the European Parliament and the Council. https://eur-lex.europa.eu/LexUriServ/LexUriServ.do?uri=OJ:L:2012:197:0038:0071:en:PDF
[14]
(2016) Act for Resource Recycling of Electrical and Electronic Equipment and Vehicles.
State Council of the Chinese Government Decree (2016) Management Methods for Restriction of the Use of Hazardous Substances in Electrical and Electronic Products. http://www.chinarohs.com
(2016) Restrictions on the Use of Certain Hazardous Substances (RoHS) in Electronic Devices. https://www.dtsc.ca.gov/restrictions-on-the-use-of-certain-hazardous-substances-rohs-in-electronic-devices
[20]
Abtew, M. and Selvaduray, G. (2000) Lead-Free Solders in Microelectronics. Materials Science &Engineering: R: Reports, 27, 95-141.
[21]
Li, C.J., Yan, Y.F., Gao, T.T. and Xu, G.D. (2020) The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-XSb High-Temperature Lead-Free Solder. Materials, 13, Article 4443. https://doi.org/10.3390/ma13194443
[22]
Fouzder, T., Gain, A.K. and Chan, D.K. (2017) Microstructure, Wetting Characteristics and Hardness of Tin-Bismuth-Silver (Sn-Bi-Ag) Solders on Silver (Ag)-Surface Finished Copper (Cu) Substrates. Journal of Materials Science: Materials in Electronics, 28, 16921-16931. https://doi.org/10.1007/s10854-017-7611-1
[23]
Fima, P., Gancarz, T. Pstrus´, J. and Sypien, A. (2012) Wetting of Sn-Zn-XIn (x= 0.5, 1.0, 1.5wt%) Alloys on Cu and Ni Substrates. Journal of Materials Engineering and Performance, 21, 595-598. https://doi.org/10.1007/s11665-012-0124-4
[24]
Ventura, T., Terzi, S., Rappaz, M. and Dahle, A.K. (2011) Effects of Solidification Kinetics on Microstructure Formation in Binary Sn-Cu Solder Alloys. ActaMaterialia, 59, 1651-1658. https://doi.org/10.1016/j.actamat.2010.11.032
[25]
Ren, G. and Collins, M.N. (2017) The Effects of Antimony Additions on Microstructures, Thermal and Mechanical Properties of Sn-8Zn-3Bi Alloys. Materials & Design, 119, 133-140. https://doi.org/10.1016/j.matdes.2017.01.061
[26]
El-Daly, A.A., Swilem, Y., Makled, M.H., El-Shaarawy, M.G. and Abdraboh, A.M. Thermal and Mechanical Properties of Sn–Zn–Bi Lead-Free Solder Alloys. Journal of Alloys and Compounds, 484, 134-142.
[27]
Das, S.K., Sharif, A., Chan, Y.C., Wong, N.B. and Yung, W.K.C. (2009) Influence of Small Amount of Al and Cu on the Microstructure, Microhardness and Tensile Properties of Sn-9Zn Binary Eutectic Solder Alloy. Journal of Alloys and Compounds, 481, 167-172. https://doi.org/10.1016/j.jallcom.2009.03.017
[28]
Silva, B.L. and Spinellib, J.E. (2018) Correlations of Microstructure and Mechanical Properties of the Ternary Sn-9wt%Zn-2wt%Cu Solder Alloy. Materials Research, 21, E20170877. https://doi.org/10.1590/1980-5373-mr-2017-0877
[29]
AL-ALbawee, A. (2020) Development of Sn-9Zn Solder Alloy by Adding Bismuth, Diyala. Journal of Engineering Sciences, 13, 37-43. https://doi.org/10.24237/djes.2020.13405
[30]
Shalaby, R.M. (2012) Effect of Silicon Addition on Mechanical and Electrical Properties of Sn-Zn Based Alloys Rapidly Quenched from Melt. Materials Science and Engineering: A, 550, 112-117. https://doi.org/10.1016/j.msea.2012.04.041
[31]
EL-Daly, A.A. and Hammand, A.E. (2010) Elastic Properties and Thermal Behavior of Sn-Zn Based Lead-Free Solder Alloys. Journal of Alloys and Compounds, 505, 793-800. https://doi.org/10.1016/j.jallcom.2010.06.142
[32]
Huang, H.-Z., Wei, X.-Q., Tan, D.-Q. and Zhou, L. (2013) Effects of Phosphorus Addition on the Properties of Sn-9Zn Lead-Free Solder Alloy. International Journal of Minerals, Metallurgy, and Materials, 20, 563-567. https://doi.org/10.1007/s12613-013-0766-8
[33]
Hu, Y.-H., Xue, S.-B., Wang, H., Ye, H. Xiao, Z.-X. and Gao, L.-L. (2011) Effects of Rare Earth Element Nd on the Solderability and Microstructure of Sn-Zn Lead-Free Solder. Journal of Materials Science: Materials in Electronics, 22, 481-487. https://doi.org/10.1007/s10854-010-0163-2
[34]
Huang, H.Z., Huang, Q.S., Peng, S. and Zhou, L. (2010) Effects of Ag Addition on Properties of Sn-9Zn Lead-Free Solder Alloys. Rare Metal Materials and Engineering, 39, 1702-1706. https://doi.org/10.1016/S1875-5372(10)60127-0
[35]
Chen, X., Hu, A.M., Li, M. and Mao, D.L. (2008) Study on the Properties of Sn-9Zn-XCr Lead-Free Solder. Journal of Alloys and Compounds, 460, 478-484. https://doi.org/10.1016/j.jallcom.2007.05.087
[36]
Billah, M.M. and Shorowordi, K.M. (2012) Effect of Micron Size Ni Particle Addition on Microstructure, Thermal and Mechanical Properties of Sn-9Zn Lead-Free Solder Alloy. Applied Mechanics and Materials, 229-231, 271-275. https://doi.org/10.4028/www.scientific.net/AMM.229-231.271
[37]
Gancarz, T. (2016) Physical, Thermal, Mechanical Properties and Microstructural Characterization of Sn-9Zn-XGa Alloys. Metallurgical and Materials Transactions A, 47, 326-333. https://doi.org/10.1007/s11661-015-3235-3
[38]
Esener, P.A., Demirel, B. and Aksöz, S. (2023) Effect of Sb and in Additives on Thermal and Electrical Properties of Sn-9Zn-4Bi Alternative Lead-Free Solder Alloy. Materials Chemistry and Physics, 296, Article 127223. https://doi.org/10.1016/j.matchemphys.2022.127223
[39]
Yavuzer, B., Özyürek, D. and Tunçay, T. (2020) Microstructure and Mechanical Properties of Sn-9Zn-XAl and Sn-9Zn-XCu Lead-Free Solder Alloys. Materials Science-Poland, 38, 34-40. https://doi.org/10.2478/msp-2020-0025
[40]
Wadud, M.A., Gafur, M.A., Qadir, M.R. and Rahman, M.O. (2015) Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys. Materials Sciences and Applications, 6, 1008-1013. https://doi.org/10.4236/msa.2015.611100
[41]
Wang, H., Xue, S.B., Zhao, F. and Chen, W.X. Effects of Ga, Al, Ag, and Ce Multi-Additions on the Wetting Characteristics of Sn-9Zn Lead-Free Solder. Rare Metals, 28, 600-605. https://doi.org/10.1007/s12598-009-0115-2
[42]
Wang, H., Xue, S.B., Chen, W.X. and Zhao, F. Effects of Ga–Ag, Ga–Al and Al–Ag Additions on the Wetting Characteristics of Sn–9Zn-X-Y Lead-Free Solders. Journal of Materials Science: Materials in Electronics, 20, 1239-1246. https://doi.org/10.1007/s10854-009-9859-6
[43]
Zhang, J.X., Xue, S.B., Xue, P. and Liu, S. Thermodynamic Reaction Mechanism of the Intermetallic Compounds of SnxNdy and GaxNdy in Soldered Joint of Sn-9Zn-1Ga-0.5Nd. Journal of Materials Science: Materials in Electronics, 26, 3064-3068. https://doi.org/10.1007/s10854-015-2798-5
[44]
Technofour Conductivity Meter Type 979. https://5.imimg.com/data5/SD/UG/HR/SELLER-1899117/digital-electrical-conductivity-meter-for-non-ferrous-metal.pdf
[45]
Chen, B.L. and Li, G.Y. (2004) Influence of Sb on IMC Growth in Sn-Ag-Cu-Sb Pb-Free Solder Joints in Reflow Process. Thin Solid Films, 462-463, 395-401. https://doi.org/10.1016/j.tsf.2004.05.063
[46]
Chen, B.L. and Li, G.Y. (2005) An Investigation of Effects of Sb on the Intermetallic Formation in Sn-3.5Ag-0.7Cu Solder Joints. IEEE Transactions on Components, Packaging and Manufacturing Technology, 28, 534-541. https://doi.org/10.1109/TCAPT.2005.848573
[47]
Islam, S.M.K.N., Sharif, A. and Alam, T. (2012) Intefacial Microstructure, Microhardness and Tensile Properties of Al Microparticle Doped Sn-9Zn Eutectic Pb-Free Solder Alloy for Microelectronics Applications. Journal of Telecommunication, Electronic and Computer Engineering, 4, 35-39.
[48]
Wadud, M.A., Gafur, M.A., Qadir, R. and Rahman, M.O. (2015) Effect of Bismuth Addition on Structure and Mechanical Properties of Tin-9Zinc Soldering Alloy. Materials Sciences and Applications, 6, 792-798. https://doi.org/10.4236/msa.2015.69081
[49]
Luo, T.B., Hu, A., Hu, J., Li, M. and Mao, D.L. (2012) Microstructure and Mechanical Properties of Sn-Zn-Bi-Cr Lead-Free Solder. Microelectronics Reliability, 52, 585-588. https://doi.org/10.1016/j.microrel.2011.10.005
[50]
Ahmed, M., Fouzder, T., Sharif, A., Gain, A.K. and Chan, Y.C. (2010) Influence of Ag Micro-Particle Additions on the Microstructure, Hardness and Tensile Properties of Sn-9Zn Binary Eutectic Solder Alloy. Microelectronics Reliability, 50, 1134-1141. https://doi.org/10.1016/j.microrel.2010.03.017
[51]
Che, F.X., Zhu, W.H., Poh, E.S.W., Zhang, X.W. and Zhang, X.R. (2010) The Study of Mechanical Properties of Sn-Ag-Cu Lead-Free Solders with Different Ag Contents and Ni Doping under Different Strain Rates and Temperatures. Journal of Alloys and Compounds, 507, 215-224. https://doi.org/10.1016/j.jallcom.2010.07.160
[52]
Long, X., He, X. and Yao, Y. (2017) An Improved Unified Creep-Plasticity Model for SnAgCu Solder under a Wide Range of Strain Rates. Journal of Materials Science, 52, 6120-6137. https://doi.org/10.1007/s10853-017-0851-x
[53]
Al-Ezzi, A., Al-Bawee, A., Dawood, F. and Shehab, A.A. (2014) Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy. Journal of Electronic Materials, 48, 8089-8095. https://doi.org/10.1007/s11664-019-07577-w
[54]
Peng, Y.Z., Li, C.J., et al. (2021) Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-XBi Solders. Metals, 11, Article 538. https://doi.org/10.3390/met11040538
[55]
Kamal, M. and Gouda, E.S. (2006) Enhancement of Solder Properties of Sn-9Zn Lead-Free Solder Alloy. Crystal Research and Technology, 41, 1210-1213. https://doi.org/10.1002/crat.200610751
